TENSILE FRACTURE MECHANISM INVESTIGATION USING DIGITAL IMAGE CORRELATION IN X100 LINEPIPE MATERIAL
Tensile fracture mechanism has been investigation in X100 linepipe materials. Tensile testing was monitored using digital image correlation and subsequently fracture location was identified. Microscopy, SEM and X-ray tomography was used to investigate the deformed fracture and partially deformed tensile sample. It was found that fracture mechanism was dominated by void formation and coalescence. Void formation occurs from micro constituent/ferrite interfaces. It is found that the hardness of microconstituents are significantly higher than surrounding matrix. In addition, microconstituent contain carbon contents which are higher than the surrounding matrix. Differences in properties between microconstituents and the matrix accelerate void formation from the interfaces. Although some void formation was observed in the matrix, 90% of the voids initiate from microconstituent/ferrite interfaces.
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